The purpose of this standard is to establish a method for determining ic latchup characteristics and to define latchup detection criteria. The equivalent circuit for vsupply overvoltage test latch up testing. Stresstestdriven qualification of integrated circuits. Latch up test eia jesd78 report available by device hrs 3. Developing a transient induced latchup standard for. An experimental study on latch up failure of cmos lsi. The parasitic structure is usually equivalent to a thyristor or scr, a pnpn structure which acts as a pnp and an npn transistor stacked next to each other. This test method is applicable to nmos, cmos, bipolar, and all variations and combinations of these technologies. Latch up current note 3 100 ma msl level 1 stresses exceeding those listed in the maximum ratings table may damage the device.
Ncp3902 highcurrent bidirectional load switch with dual. These types are input, output, bidirectional io, power supply and ground. Uc3842b, uc3843b, uc2842b, uc2843b high performance. You can find the electrical specifications in each respective device family data sheet. Pdf developing a transient induced latchup standard for. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. As specified for a jedec 511 conductivity test pcb. Latchup characteristics are extremely important in determining product reliability and minimizing no trouble found ntf and electrical overstress eos failures due to latchup. Referenced the latest version of the jedec ic latch up test specification jesd78. Latch up test jesd78 datasheet, cross reference, circuit and application notes in pdf format. Rt11 jedec test service leaflet 2018 dd created date. The latchup area is confined by a bar of nwsx contacts on the topside and decoupling capacitances on the bottom. This parameter is measured at the latch trip point with vfb 0 v. Recent listings manufacturer directory get instant.
Best practices in the manufacturing process of mems microphones introduction this application note serves as a reference concerning best practices in the manufacturing process of mems microphones. The concept of maximum stress voltage msv allows the supplier to characterize latch up in a way that differentiates between latch up and eos. Lial02qlqs455 date january 20, 2020 qualification of global foundries fab 35 gf358 as a new fabrication site for the selected smsc products of ece1117. These products have undergone thorough quality and reliability testing as st manufacturing processes have been carefully studied and.
Jesd78 latchup testing, esd, might require to exceed amr to evaluate robustness limits. Short circuits can cause excessive heating and eventual destruction. The purpose of this specification is to establish a method for determining ic latch up characteristics and to define latch up failure criteria. Automotive electronics council change notification the following summary details the changes incorporated into aecq04 revd.
Aecq04 ic latch up test aecq05 nonvolatile memory programerase endurance, data retention and. Proprietary latch immune cmos technologies enable ruggedized monolithic construction. A single event latchup is a latchup caused by a single event upset, typically heavy ions or protons from cosmic rays or solar flares. If altera devices are operated within the absolute maximum electrical ratings, there should not be any latchup failures. All latchup testing performed on integrated circuit devices to be aec. Best practices in the manufacturing process of mems. Pdf developing a transient induced latchup standard for testing.
Jesd78 datasheet, cross reference, circuit and application notes in pdf format. Simply defined, latchup is a functional chip failure associated with excessive current going through the chip, caused by weak circuit design. Latch up lu the latch up characterization was successfully completed on samples from one 1 lot of rr1x2 series using excessive current flow between the power supply and ground as well as output to power pin and to ground. This is due to the fact that all c pins are always connected to power supplies through resistors. Jesd78, datasheet, cross reference, circuit and application notes in pdf format. Aec documents are designed to serve the automotive electronics. The irs2334 is a high voltage, high speed power mosfet and igbt driver with three independent high side and low side referenced output channels for 3phase applications. A latchup is a type of short circuit which can occur in an integrated circuit ic. Automotive product aecq 100g qualification test plan. Pcn lial02qlqs455 qual report microchip technology. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be. If any of these limits are exceeded, device functionality.
Applicable limits are not part of the datasheet but are described in the specification of stress testing. There are efforts underway on the jedec latchup team to add analog methodology, which will likely be completed late in 2015. The irs44273l is a low voltage, power mosfet and igbt noninverting gate driver. This standard is commonly referenced in ic qualification specifications. Test conditions were under natural convection or zero air flow.
The following diagram is a drawing of a typical cmos circuit. Esd hbm and cdm qualification values might be provided in datasheets. The equivalent circuit for vsupply overvoltage test latchup testing. Ds18b20, rev c3 dallas semiconductor maxim integrated. Proprietary hvic and latch immune cmos technology enables ruggedized monolithic construction. Our highly experienced engineering team uses their industry leading knowledge and years of real world experience with the latest semiconductor technologies, circuit design, and device physics to optimize our customers esd and latchup results. Pdf this paper presents the results of a search for a more effective stimulus suitable for assessing the. Latch up characteristics are extremely important in determining product reliability and minimizing no trouble found ntf and electrical overstress eos failures due to latch up.
The purpose of this standard is to establish a method for determining ic latch up characteristics and to define latch up detection criteria. The logic input is compatible with standard cmos or lsttl output. Could i ask you an additional question as the follow. Joint electron device engineering council ic latch up test jesd78a revision of jesd78 jedec standard join researchgate to find the people and research you need to help your work. Pdf optical and electrical testing of latchup in io interface circuits. This standard covers the itest and vsupply overvoltage latchup testing of integrated circuits. Note 1 the overstress can be a voltage or current surge, an excessive rate of change of current or voltage, or. Test per jedec jesd78 with the aecq04 requirements. This device contains latch up protection and exceeds 100 ma per jedec standard jesd78.
Hello luis, thank you very much for your prompt reply. If there are any questions about this qualification, please contact quality support at. In some cases latchup can be a temporary condition that can be resolved by power cycle, but unfortunately it can also cause a fatal chip failure. Therefore, different trigger stimuli were investigated to help identify potentially sensitive circuit designs this early work served as the foundation for the creation of the esd association esda transient induced latchup tlu working group wg5. Kinetis k64f subfamily data sheet nxp semiconductors.
Fan54120 500 ma usb compatible single cell lilon linear. A state in which a lowimpedance path, resulting from an overstress that triggers a parasitic thyristor structure, persists after removal or cessation of the triggering condition. Developing a transient induced latch up standard for testing integrated circuits conference paper pdf available february 1999 with 349 reads how we measure reads. File system clocks time server interprocess communication ipc server. Added definition for maximum stress voltage msv, etest. This revision will make it more transparent to the end user that given the limits of certain technologies the subsequent latch up characterizations are valid. Pericom process qualification report mfgfabprocess.